ICs (Integrated Circuits)
Integrated Circuits (ICs)
Integrated Circuits (ICs) power modern electronics with compact, high-performance solutions. From microcontrollers and op-amps to power management and signal processors, we stock top brands. Fast delivery, competitive pricing, and full datasheets ensure seamless integration.
We offer an extensive portfolio of integrated circuits (ICs) engineered to meet the stringent requirements of diverse industries.
- ✓ Compact and Efficient – Combine multiple electronic functions into a single chip.
- ✓ High Reliability – Ensure stable and long-lasting performance in various applications.
- ✓ Cost-Effective – Reduce component count and manufacturing costs.
- ✓ Versatile – Used in microcontrollers, amplifiers, logic gates, sensors, and control systems.
Integrated Circuits (ICs)
Base on Category
Linear (Analog) ICs:
- ✓Operational Amplifiers (Op-Amps) : Signal amplification, filters, comparators
- ✓Voltage Regulators : Provide stable DC output
- ✓Audio Amplifiers : Sound amplification in audio systems
- ✓Comparators : Compare voltage levels
- ✓Analog Multipliers / Modulators : Signal processing, mixers
- ✓Sensor ICs : Temperature, pressure, or light sensors
Digital ICs
- ✓ Logic Gates : Basic Boolean operations
- ✓Flip-Flops & Latches : Memory and timing elements
- ✓Counters & Timers : Sequential logic, timing
- ✓Multiplexers/Demultiplexers : Data routing and selection
- ✓Encoders/Decoders : Signal conversion, display control
- ✓Microcontrollers : Complete processors with memory
- ✓Microprocessors : CPUs for computers and systems
- ✓Memory ICs : Data storage (RAM, ROM, Flash, EEPROM)
- ✓Programmable Logic Devices (PLD, FPGA, CPLD) : Custom digital logic configurations
Mixed-Signal ICs
- ✓ADC (Analog to Digital Converter) : Converts analog signals to digital
- ✓DAC (Digital to Analog Converter): Converts digital signals to analog
- ✓Communication ICs : Interface and
RF chips (e.g., UART, CAN, RS-485,
Bluetooth, Wi-Fi) - ✓Power Management ICs: DC converters, battery management,sequencing
- ✓Clock & Timing ICs : Oscillators, clock generators, PLLs
- ✓Power ICs : Regulators, converters, drivers, battery chargers
- ✓Communication ICs :RF transceivers, modems, Bluetooth, Wi-Fi
- ✓Interface ICs : USB, RS232, RS485, CAN, Ethernet PHY
- ✓Sensor ICs : Accelerometers, gyroscopes, temperature sensors
- ✓Driver ICs : Motor drivers, LED drivers, relay drivers
- ✓Display ICs : LCD, LED, OLED control
- ✓Timing ICs : RTC (Real Time Clock), PLLs, oscillators
- ✓Security ICs : Cryptographic chips, secure elements
- ✓Memory ICs : SRAM, DRAM, Flash, EEPROM
- ✓Signal Processing ICs : DSPs, filters, codec ICs
- ✓AI/ML ICs : Neural network accelerators, edge AI processors
- ✓SoC (System-on-Chip) : Combines CPU, memory, and peripherals on one chip
Common Packages of Integrated Circuits
Through-Hole Packages
- ✓DIP / PDIP: Dual In-line Package (Plastic or Ceramic)
- ✓SIP: Single In-line Package
- ✓ZIP: Zig-zag In-line Package
- ✓CDIP: Ceramic Dual In-line Package
- ✓TO-99 / Metal Can: Round metal can
- ✓CERDIP / PDIL: Ceramic or Plastic DIP
Surface-Mount (SMD) IC Packages
- ✓SOIC: Small Outline
- ✓SSOP / TSOP: Shrink / Thin Small Outline Package
- ✓TSSOP: Thin Shrink Small Outline Package
- ✓MSOP: Mini Small Outline Package
- ✓VSOP / QSOP: Very / Quarter Small Outline Package
- ✓SOJ: Small Outline J-Lead
- ✓SOP-8 / SOP-16: Small Outline Package
- ✓DFN / QFN: Dual / Quad Flat No-Lead
- ✓WSON / TSON / USON: Very thin no-lead packages
- ✓PLCC: Plastic Leaded Chip Carrier
- ✓LCCC / CLCC: Leadless Ceramic Chip Carrier
- ✓LGA: Land Grid Array
- ✓BGA: Ball Grid Array
- ✓CSP / WLCSP: Chip Scale Package / Wafer Level CSP
- ✓QFP / TQFP: (Thin) Quad Flat Package (32–208 pins)
- ✓LQFP / VQFP: Low / Very Thin QFP (32–256 pins)
- ✓PQFP / MQFP: Plastic / Metric QFP (44–208 pins)
- ✓QFN / MLF: Quad Flat No-Lead / Micro Lead Frame (16–100 pins)
- ✓BSON / CSP-BGA: Micro ball grid variant
- ✓SON / DFN / QFN-EP: No-lead with exposed pad
Power & Specialized IC Packages
- ✓TO-220 / TO-263 (D²PAK): Power regulators, driver ICs
- ✓TO-252 (DPAK): Power management ICs
- ✓Power-QFN / ePad: Thermal pad for heat dissipation
- ✓Multi-Chip Module (MCM): Multiple dies in one package
- ✓System-in-Package (SiP): SoC + memory + analog in one
- ✓COB (Chip-on-Board): Die mounted directly on PCB
- ✓FC-BGA (Flip-Chip BGA): High-speed CPUs, GPUs
- ✓QFN-EP: QFN with exposed pad for heat sinking
